Install
$ agentstack add mcp-ed3design-ed3design-engineering-bundles ✓ scanned · ✓ verified — works with Claude Code, Cursor, and more.
Security review
✓ PassedNo issues found. Passed automated security review. · v0.1.0 How review works →
- ✓ Prompt-injection patterns
- ✓ Secret / credential exfiltration
- ✓ Dangerous shell & filesystem operations
- ✓ Untrusted network calls
- ✓ Known-malicious package signatures
What it can access
- ✓ Network access No
- ✓ Filesystem access No
- ✓ Shell / process execution No
- ✓ Environment & secrets No
- ✓ Dynamic code execution No
From automated source analysis of v0.1.0. “Used” means the capability is present in the source — more access means more to trust, not that it’s unsafe.
About
ed3design-engineering-bundles
[](LICENSE)
> Engineering-discipline library for Claude Code power users — hardware/maker focus. 8 skills across 3 thematic bundles covering parametric CAD, FDM/maker workflows, and embedded systems integration.
Sibling to ed3design-skill-bundles (software-engineering focus). This repo concentrates on the physical engineering disciplines: CAD design, 3D-printed builds, embedded device onboarding.
📦 Bundles
| Bundle | Skills | Status | |---|---|---| | [cad-design](./cad-design/) | 5 (CAD API scripting, construction workflows, mechanical design principles, image-to-mesh, Fusion MCP-Bridge) | 🟡 v0.1.0 alpha | | [maker-fdm](./maker-fdm/) | 2 (BOM validation, embedded GUI documentation) | 🟡 v0.1.0 alpha | | [embedded-systems](./embedded-systems/) | 1 (Victron Cerbo GX Modbus onboarding — Enabled=0 default trap) | 🟡 v0.1.0 alpha |
Total: 8 skills + 1 helper tool — patterns extracted from real-world physical engineering practice and structured for reuse.
> [!NOTE] > Status is alpha until the first signed v0.1.0 Git tag is published. All bundles currently pass claude plugin validate --strict via CI on every PR, but no stable release has been cut yet. Treat the install instructions as pre-release for now.
🚀 Quickstart
Via Claude Code Marketplace
/plugin marketplace add Ed3Design/ed3design-engineering-bundles
/plugin install cad-design@ed3design-engineering-bundles
/plugin install maker-fdm@ed3design-engineering-bundles
/plugin install embedded-systems@ed3design-engineering-bundles
Manual Install
git clone https://github.com/Ed3Design/ed3design-engineering-bundles
ln -s "$(pwd)/ed3design-engineering-bundles/cad-design/skills"/* ~/.claude/skills/
ln -s "$(pwd)/ed3design-engineering-bundles/maker-fdm/skills"/* ~/.claude/skills/
ln -s "$(pwd)/ed3design-engineering-bundles/embedded-systems/skills"/* ~/.claude/skills/
🧭 Why a separate repo from ed3design-skill-bundles?
The software-engineering bundles (token-savers, code-quality, planning, schema-discipline, etc.) share an audience: developers who write code. The hardware/maker bundles share a different audience: makers, mechanical engineers, embedded-systems hobbyists. Splitting them into two repos makes discovery clearer for both audiences and lets each repo grow without bloating the other.
🔗 Related
ed3design-skill-bundles— software engineering: token optimization, code quality, planning, async/SQL debugging, skill-system metaed3designbrand: maker-focused engineering tools for makers, makers' AI workflows, and CAD/3D-printing automation
📚 Pattern Compound
A typical hardware engineering session might layer these bundles:
cad-design— design the part (parametric CAD, MCP-Bridge for closed-loop iteration)maker-fdm— validate the BOM before ordering, document the embedded UI from sourceembedded-systems— onboard the new Victron/Modbus device on first connection
Each bundle works standalone, but loaded together they cover the design → build → integrate flow end-to-end.
License
MIT. See [LICENSE](LICENSE).
Source & license
This open-source MCP server is cataloged on AgentStack and links to its original source — we do not rehost the code.
- Author: Ed3Design
- Source: Ed3Design/ed3design-engineering-bundles
- License: MIT
Install and usage instructions live in the source repository linked above.
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Versions
- v0.1.0 Imported from the upstream source.